Experience Highlights:
Housing/QFP Design, CAD RF Test and Tuning DC-Optical, Die Level Manufacturing
Physical PCB design layout, Prototyping and EV’s, Team Management
Work Experience:
2003-Dec 2007: Design / Test Engineer, Company A, Buena Park CA
Responsible for physical design and layout of Clariant's security imaging and automotive radar products. Additionally supported in the design of high density printed circuit boards. Responsibilities have included the design of packaging & tile module housings, unit mechanical layouts and floor plans, and control printed circuit board layouts. Including assembly, test and debugging of prototypes for Clariant's security imaging products, as well as hermetic modules and subassemblies for a low cost, wideband radar receiver as part of Clariant’s design services subsidiary, GHz Consulting Group.
2003-2004: Design Engineer (Outsource Contractor), Company B, San Diego CA.
Brought on to develop in house capability for mounting proprietary Laser diodes in development by OptiSwitch. Work performed: Process development, tooling and fixture design. Including proper assembly profiles needed for the eutectic die attach process. Plus assistance in 2d masks and mask set generation for wafer processing.
2000-2003: Design / Test Engineer,Company C, Santa Monica CA
Responsibilities included design and layout of hermetic modules and packaging for high frequency products including modulator drivers, mux / dmux products, amplifiers, clock and data recovery modules, and transceiver products. Additionally, designed test boards and sockets for product testing and qualification needed for large scale assembly. Material planning and procedure documentation.
1998-2000: Senior Associate Engineer / In house Manufacturing Supervisor, Company D, Santa Monica CA.
Responsibilities included management of the in-house manufacturing and test teams of over 20 test and assembly technicians, support of off-site manufacturing and test vendors, responsible for debugging RMA’s, running HTOL unit failures and continued design and assembly of EV’s to key customers. Organization of a new 10,000 sq. ft. facility with the procurement of die attach, wire bond, RF test equipment and needed supplies for new manufacturing facility for the need of the growing company to its new facility in Somerset New Jersey. Was able to travel extensively to the new sight, hire and train a team of assemblers and technicians to bring up the new production and test line for the under sea hermetic CDR (Clock and Data Recovery) modules. Developed and documented an extensive test procedure using the HP N4700 10Gb/s Serial BERT (Bit Error Rate Test) and Clock Jitter Transition Test equipment. Was able to complete the set up and initial start of the new facility in the assigned 3 month time frame.
1997-1998: Associate Engineer, Company E, Santa Monica CA
Responsible for assembly and test of hermetic and non-hermetic QFP’s first generation 10 Gb/s laser drivers and MUX/DMUX’s using various die processes, wire/ribbon bonding and epoxies. Data generation and quantification, trained assembly and test technicians as the company expanded internally.
1995-1997: Associate Engineer, Company F, Valencia CA
Working with a small team under exclusive contract by the USAF to develop silicon based solutions using large scale MEMs devices to replace large and heavy components found in conventional ordinances. Responsibilities included but not limited to analog and digital test and trouble shooting of closed and open loop circuits. Created masks and mask sets using CAD software, assisted in the development of die and SMT lay out, epoxy and ball bonding techniques, Collimated optics for an Nd Yag Laser work station with more then 1000 hrs logged, with some light silicon wafer processing and laboratory work experience.
1993-1995: Lead Technician, Company G, Burbank CA
Continued skill sets in the fabrication and production of high power NiCd/NiMH power packs, and responsible in the transition from relay based power switching to transistor based technology for reliability and cost savings form labor to component count.
1992-1993: Lead Technician, Company H Hollywood CA
Fabrication and production of high power NiCd/NiMH power packs, power management mostly used in the professional film industry.
DESIGN SOFTWARE & TEST EQUIPMENT SKILLS:
AutoCad, 2D 3D, CAM-350, some Rhino CAD & SolidWorks, LabView, Image Manipulation/Editing PhotoShop, MS Office, HP & Anritsu Network Analyzers Calibrations, Spectrum Analyzers, Error Detectors, Digital Scopes, System test setup, CCD Imaging Systems, Westbond & HK Wirebond, Ballbond and Die Bond Machines, Laser test beds, Ovens, Plasma Cleaners, most all lab/laboratory equipment.
EDUCATION:
AASE, ITT Los Angeles 1991
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